SenseICs [Sen-Siks] is engineering innovation by designing and developing the world’s most advanced integrated circuit (IC) technology. At SenseICs, we combine decades of engineering expertise with a forward-thinking, company-wide commitment to exploring what’s next in integrated circuit and electronic systems design. SenseICs is dedicated to reimagining the status quo, designing and building next-generation circuits, and delivering the best possible solutions to meet the needs of our customers in the defense, energy, automotive, and medical industries.
Leadership
At SenseICs, we believe that our people are our greatest strength. The SenseICs team is uniquely made up of leading-edge experts who come from diverse areas of engineering expertise. Because of our multidisciplinary nature, we approach design and development with a fresh perspective, which enables us to provide our customers with innovative, yet proven, technology solutions.
Ramy Tantawy, PhD
CEO and Co-Founder
Dr. Ramy Tantawy is the CEO and co-founder of SenseICs. He received his BS and ME degrees with distinction in Electrical Engineering from Northern Arizona University in 2001 and 2003, respectively. He received his MSEE and PhD degrees in Electrical and Computer Engineering from The Ohio State University 2019 and 2023, respectively. Prior to founding SenseICs, Dr. Tantawy spent more than 15 years in mixed-signal integrated circuit design at Intel Corporation, Micron Technology – Imaging Group (now ONSemi), and Forza Silicon (now Forza-AMETEK). He participated in various technical, business development, and leadership roles to design and develop high-performance image sensors and advanced integrated circuit solutions for ultimate use in mobile, cinematography, medical, automotive, and defense applications. He authored and co-authored 8 issued patents, various pending patents, and more than 20 journal and conference articles. Dr. Tantawy is also the Chair and Co-founder of the Columbus IEEE SSCS & CASS Joint Chapter.
Areas of expertise:
- Readout integrated circuits (ROICs)
- Imaging sensors
- Trusted microelectronics
- Radio frequency (RF) design
- High-speed communication
- Clock and data recovery (CDR)
Dale Shane Smith, PhD
President and Co-Founder
Dr. Shane Smith (Ph.D., Electrical and Computer Engineering, The Ohio State University) is the President and co-founder of SenseICs. Before founding SenseICs, Shane worked for more than 15 years in the Electroscience Lab and Department of Physics at The Ohio State University, where he designed, produced, and maintained electronic systems used in integrated circuit research, high energy physics experiments (CERN, Stanford linear accelerator, etc.), and other applications. Shane’s broad expertise covers a range of electrical engineering activities, and his academic publications, which include more than 80 peer-reviewed conference papers and journal articles, have been cited nearly 20,000 times.
Areas of expertise:
- Hardening ICs by design for high radiation environments, > 100 Mrad TID
- High reliability ICs
- Trusted microelectronics
- Medical imaging electronics
- Diamond particle detectors and electronics
Industry & Academic Partners
SenseICs is proud to collaborate with The Ohio State University. We are close partners with a number of research facilities on-campus, including the ElectroScience Laboratory, Nanotech West Lab, and the Department of Physics. These partnerships offer SenseICs access to state-of-the-art resources for engineering research and development. With Ohio State, SenseICs is raising the profile of Ohio as a center of next-generation electronics engineering.
1275 Kinnear Road
Columbus, OH 43212
info@senseics.com
(614) 600-1834
© SenseICs 2024.