Leadership
At SenseICs, we believe that our people are our greatest strength. The SenseICs team is uniquely made up of leading-edge experts who come from diverse areas of engineering expertise. Because of our multidisciplinary nature, we approach design and development with a fresh perspective, which enables us to provide our customers with innovative, yet proven, technology solutions.
Ramy Tantawy
CEO and Co-Founder
Ramy Tantawy is the CEO and co-founder of SenseICs, as well as a Ph.D. Candidate in Electrical and Computer Engineering at The Ohio State University. Ramy received B.S. and M.E. degrees with distinction in Electrical Engineering from Northern Arizona University in 2001 and 2003, respectively. Prior to founding SenseICs, Ramy spent more 15 years in mixed-level circuit design for companies such as Intel Corporation, Micron Technology – Imaging Group (now ONSemi), and Forza Silicon (now Forza-AMETEK). In each of these roles, Ramy designed and developed high-performance image sensors and integrated circuits for ultimate use in mobile, cinematography, medical, automotive, and defense applications. Ramy has authored five patents and more than 15 academic articles.
Areas of expertise:
- Readout integrated circuits (ROICs)
- Imaging sensors
- Trusted microelectronics
- Radio frequency (RF) design
- High-speed communication
- Clock and data recovery (CDR)
Dale Shane Smith, PhD
President and Co-Founder
Dr. Shane Smith (Ph.D., Electrical and Computer Engineering, The Ohio State University) is the President and co-founder of SenseICs. Before founding SenseICs, Shane worked for more than 15 years in the Electroscience Lab and Department of Physics at The Ohio State University, where he designed, produced, and maintained electronic systems used in integrated circuit research, high energy physics experiments (CERN, Stanford linear accelerator, etc.), and other applications. Shane’s broad expertise covers a range of electrical engineering activities, and his academic publications, which include more than 80 peer-reviewed conference papers and journal articles, have been cited nearly 20,000 times.
Areas of expertise:
- Hardening ICs by design for high radiation environments, > 100 Mrad TID
- High reliability ICs
- Trusted microelectronics
- Medical imaging electronics
- Diamond particle detectors and electronics
Affiliations
SenseICs is proud to collaborate with The Ohio State University. We are close partners with a number of research facilities on-campus, including the ElectroScience Laboratory, Nanotech West Lab, and the Department of Physics. These partnerships offer SenseICs access to state-of-the-art resources for engineering research and development. With Ohio State, SenseICs is raising the profile of Ohio as a center of next-generation electronics engineering.
© SenseICs 2023.