$8,400.00
SenseICs ROIC Test Dies FPA-ready for Indium Bump Hybridization (5 units). Contact us for lead time.
High-speed infrared event-based imaging platform for evaluation, prototyping, and algorithm development.
1275 Kinnear Road Columbus, OH 43212
info@senseics.com
(614) 600-1834
© SenseICs 2026.