ROIC Test Dies

$8,400.00

SenseICs ROIC Test Dies FPA-ready for Indium Bump Hybridization (5 units). Contact us for lead time.

Integrated Circuit Analysis Service

$9,999.00

Professional engineering analysis service for integrated circuit verification, simulation, characterization, or design-support activities. Scope, deliverables, and schedule defined separately in customer approved statement of work. Please reference the applicable quote when placing an order.

IR Event-Based Camera Development Kit

High-speed infrared event-based imaging platform for evaluation, prototyping, and algorithm development.